NexTech 2021 Congress
October 03, 2021 to October 07, 2021 - Barcelona, Spain

  • UBICOMM 2021, The Fifteenth International Conference on Mobile Ubiquitous Computing, Systems, Services and Technologies
  • ADVCOMP 2021, The Fifteenth International Conference on Advanced Engineering Computing and Applications in Sciences
  • SEMAPRO 2021, The Fifteenth International Conference on Advances in Semantic Processing
  • AMBIENT 2021, The Eleventh International Conference on Ambient Computing, Applications, Services and Technologies
  • EMERGING 2021, The Thirteenth International Conference on Emerging Networks and Systems Intelligence
  • DATA ANALYTICS 2021, The Tenth International Conference on Data Analytics
  • GLOBAL HEALTH 2021, The Tenth International Conference on Global Health Challenges
  • CYBER 2021, The Sixth International Conference on Cyber-Technologies and Cyber-Systems

SoftNet 2021 Congress
October 03, 2021 to October 07, 2021 - Barcelona, Spain

  • ICSEA 2021, The Sixteenth International Conference on Software Engineering Advances
  • ICSNC 2021, The Sixteenth International Conference on Systems and Networks Communications
  • CENTRIC 2021, The Fourteenth International Conference on Advances in Human-oriented and Personalized Mechanisms, Technologies, and Services
  • VALID 2021, The Thirteenth International Conference on Advances in System Testing and Validation Lifecycle
  • SIMUL 2021, The Thirteenth International Conference on Advances in System Simulation
  • SOTICS 2021, The Eleventh International Conference on Social Media Technologies, Communication, and Informatics
  • INNOV 2021, The Tenth International Conference on Communications, Computation, Networks and Technologies
  • HEALTHINFO 2021, The Sixth International Conference on Informatics and Assistive Technologies for Health-Care, Medical Support and Wellbeing

NetWare 2021 Congress
November 14, 2021 to November 18, 2021 - Athens, Greece

  • SENSORCOMM 2021, The Fifteenth International Conference on Sensor Technologies and Applications
  • SENSORDEVICES 2021, The Twelfth International Conference on Sensor Device Technologies and Applications
  • SECURWARE 2021, The Fifteenth International Conference on Emerging Security Information, Systems and Technologies
  • AFIN 2021, The Thirteenth International Conference on Advances in Future Internet
  • CENICS 2021, The Fourteenth International Conference on Advances in Circuits, Electronics and Micro-electronics
  • ICQNM 2021, The Fifteenth International Conference on Quantum, Nano/Bio, and Micro Technologies
  • FASSI 2021, The Seventh International Conference on Fundamentals and Advances in Software Systems Integration
  • GREEN 2021, The Sixth International Conference on Green Communications, Computing and Technologies

TrendNews 2021 Congress
November 14, 2021 to November 18, 2021 - Athens, Greece

  • CORETA 2021, Advances on Core Technologies and Applications
  • DIGITAL 2021, Advances on Societal Digital Transformation

 


ThinkMind // ALLSENSORS 2017, The Second International Conference on Advances in Sensors, Actuators, Metering and Sensing // View article allsensors_2017_1_30_70037


Design and Fabrication of Sensor Chip with Heater for Semiconductor Flip-Chip Package Application

Authors:
Boo Taek Lim
Young-Su Kim
Nam Soo Park
Boung Ju Lee

Keywords: semiconductor; sensor chip; heater; micro-bump; flip-chip package; thermal reliability

Abstract:
A heat generated from semiconductor chips and chip packages is considered a critical issue for high-performance and reliable device operation. In this paper we demonstrate a simple semiconductor chip with both heat generation and temperature sensor functions. By evaluating the relationship between the temperature of the chip and the resistance of the sensor, the thermal properties of the semiconductor package material can be determined. The heat generation block and temperature sensor are made of aluminum lines, not active circuit, so manufacturing cost is low and the processes are simple

Pages: 8 to 9

Copyright: Copyright (c) IARIA, 2017

Publication date: March 19, 2017

Published in: conference

ISSN: 2519-836X

ISBN: 978-1-61208-543-2

Location: Nice, France

Dates: from March 19, 2017 to March 23, 2017

SERVICES CONTACT
2010 - 2017 © ThinkMind. All rights reserved.
Read Terms of Service and Privacy Policy.