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InfoSys 2025 Congress
March 09, 2025 to March 13, 2025 - Lisbon, Portugal
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InfoWare 2025 Congress
March 09, 2025 to March 13, 2025 - Lisbon, Portugal
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DataSys 2025 Congress
April 06, 2025 to April 10, 2025 - Valencia, Spain
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April 06, 2025 to April 10, 2025 - Valencia, Spain
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May 18, 2025 to May 22, 2025 - Nice, France
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May 18, 2025 to May 22, 2025 - Nice, France
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IARIA Congress 2025, The 2025 IARIA Annual Congress on Frontiers in Science, Technology, Services, and Applications
July 06, 2025 to July 10, 2025 - Athens, Greece
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July 06, 2025 to July 10, 2025 - Athens, Greece
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NexTech 2025 Congress
September 28, 2025 to October 02, 2025 - Lisbon, Portugal
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SoftNet 2025 Congress
September 28, 2025 to October 02, 2025 - Lisbon, Portugal
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SocSys 2025 Congress
October 26, 2025 to October 30, 2025 - Barcelona, Spain
NetWare 2025 Congress
October 26, 2025 to October 30, 2025 - Barcelona, Spain
- SENSORCOMM 2025, The Nineteenth International Conference on Sensor Technologies and Applications
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- AFIN 2025, The Seventeenth International Conference on Advances in Future Internet
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- FASSI 2025, The Eleventh International Conference on Fundamentals and Advances in Software Systems Integration
- GREEN 2025, The Tenth International Conference on Green Communications, Computing and Technologies
- HEALTHINFO 2025, The Tenth International Conference on Informatics and Assistive Technologies for Health-Care, Medical Support and Wellbeing
TechWorld 2025 Congress
October 26, 2025 to October 30, 2025 - Barcelona, Spain
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ThinkMind // ADVCOMP 2024, The Eighteenth International Conference on Advanced Engineering Computing and Applications in Sciences // View article advcomp_2024_3_30_20016
FEM Modeling for PCB Assembly Simulation
 Authors:
Ming-Hsiao Lee
Jiunn-Horng Lee
Chih-Min Yao
Jen-Gaw Lee Keywords: PCB; PCBA; Warpage; Trace mapping. Abstract:
A Printed Circuit Board (PCB) is a multi-layered composite, which consists of several layers of copper circuits and dielectric materials. It is used as a backbone to carry and connect various electronic components, i.e., PCB Assembly (PCBA), to achieve certain functions. Currently, most of the products need PCBAs to fulfill their functions. Nevertheless, because the components, e.g., chips, are decreasing in size, the accuracy and reliability of PCBAs have become critical issues, either in manufacturing processes or in actual uses. One of the serious problems is the warpage of the PCB, which is induced by the thermal mismatch due to unevenly-distributed circuits and multi-materialled components during the manufacturing process, which experiences a large temperature change. This may cause defects and failures in the assemblies, e.g., the chips and PCB are not well connected due to the dislocation. It is helpful to simulate in advance to evaluate possible defects. However, since the circuits on a PCB are very tiny, compared with the size of the PCB or the components, it is unpractical and not feasible to build a finite element model to include all the details of circuits and components, which are attached to the PCB with a big amount of solder joints. To avoid the difficulties, a new effective modeling approach, which adopts equivalent material properties, is proposed for PCBA’s simulation. In this approach, the multi-layered PCB and the attached components are modeled with a moderate mesh, while the circuit’s and solder joint’s effects are still included. With the proposed approach, the analysis model can be useful and efficient for simulating the PCBA to evaluate the manufacturing process and structural characteristics of the PCBA. Pages: 49 to 51 Copyright: Copyright (c) IARIA, 2024 Publication date: September 29, 2024 Published in: conference ISSN: 2308-4499 ISBN: 978-1-68558-184-8 Location: Venice, Italy Dates: from September 29, 2024 to October 3, 2024
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